Amd Geode SC2200 User Manual Page 43
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AMD Geode™ SC2200 Processor Data Book 45
Signal Definitions
32580B
3.2 Strap Options
Several balls are read at power-up that set up the state of
the SC2200. These balls are typically multiplexed with
other functions that are outputs after the power-up
sequence is complete. The SC2200 must read the state of
the balls at power-up and the internal PU or PD resistors
do not guarantee the correct state will be read. Therefore, it
is required that an external PU or PD resistor with a value
of 1.5 KΩ be placed on the balls listed in Table 3-4. The
value of the resistor is important to ensure that the proper
state is read during the power-up sequence. If the ball is
not read correctly at power-up, the SC2200 may default to
a state that causes it to function improperly, possibly result-
ing in application failure.
Table 3-4. Strap Options
Strap Option Muxed With Ball No.
Nominal
Internal
PU or PD
External PU/PD Strap Settings
Register ReferencesStrap = 0 (PD) Strap = 1 (PU)
CLKSEL0 RD# B8 PD
100
See Table 4-7 on page 89 for
CLKSEL strap options.
GCB+I/O Offset 1Eh[9:8] (aka CCFC register
bits [9:8]) (RO): Value programmed at reset
by
CLKSEL[1:0].
GCB+I/O Offset 10h[3:0] (aka MCCM regis-
ter bits [3:0]) (RO): Value programmed at
reset by
CLKSEL[3:0].
GCB+I/O Offset 1Eh[3:0] (aka CCFC register
bits [3:0]) (R/W, but write not recommended):
Value programmed at reset by CLKSEL[3:0].
Note: Values for GCB+I/O Offset 10h[3:0]
and 1Eh[3:0] are not the same.
CLKSEL1 SOUT1 AF3 PD
100
CLKSEL2 SOUT2 D29 PD
100
CLKSEL3 SYNC P30 PD
100
BOOT16 ROMCS# C8 PD
100
Enable boot
from 8-bit ROM
Enable boot
from 16-bit
ROM
GCB+I/O Offset 34h[3] (aka MCR register bit
3) (RO): Reads back strap setting.
GCB+I/O Offset 34h[14] (R/W): Used to allow
the ROMCS# width to be changed under pro-
gram control.
TFT_PRSNT SDATA_OUT P29 PD
100
TFT not muxed
onto Parallel
Port
TFT muxed
onto Parallel
Port
GCB+I/O Offset 30h[23] (aka PMR register
bit 23) (R/W): Reads back strap setting.
LPC_ROM PCICLK1 D6 PD
100
Disable boot
from ROM on
LPC bus
Enable boot
from ROM on
LPC bus
F0BAR1+I/O Offset 10h[15] (R/W): Reads
back strap setting and allows LPC ROM to be
changed under program control.
FPCI_MON PCICLK0 A4 PD
100
Disable Fast-
PCI, INTR_O,
and SMI_O
monitoring sig-
nals.
Enable Fast-
PCI, INTR_O,
and SMI_O
monitoring sig-
nals. (Useful
during debug.)
GCB+I/O Offset 34h[30] (aka MCR register
bit 30) (RO): Reads back strap setting.
Note: For normal operation, strap this signal
low using a 1.5 KΩ resistor.
DID0 GNT0# C5 PD
100
Defines the system-level chip ID. GCB+I/O Offset 34h[31,29] (aka MCR regis-
ter bits 31 and 29) (RO): Reads back strap
setting.
Note: GNT0# must have a PU resistor of 1.5
KΩ and GNT1# must have a PD resistor of
1.5 KΩ.
DID1 GNT1# C6 PD
100
Note: Accuracy of internal PU/PD resistors: 80K to 250K.
Location of the GCB (General Configuration Block) cannot be determined by software. See the AMD Geode™ SC2200 Proces-
sor Specification Update document.
- AMD Geode™ SC2200 Processor 1
- Data Book 1
- Contents 3
- List of Figures 5
- List of Tables 10
- 1.0Overview 13
- 1.2 Features 14
- Overview 16
- 2.0Architecture Overview 17
- 2.2 Video Processor Module 22
- 2.3 Core Logic Module 23
- 2.4 SuperI/O Module 23
- 2.5.1 Reset Logic 24
- 3.0Signal Definitions 25
- Signal Definitions 26
- 3.1 Ball Assignments 27
- SC2200 Processor 28
- 3.2 Strap Options 43
- 3.4 Signal Descriptions 48
- 3.4.9 IDE Interface Signals 59
- 3.4.16 GPIO Interface Signals 66
- (Continued) 69
- Reserved - RSVD 78
- 4.3 WATCHDOG 79
- 4.3.2 WATCHDOG Registers 80
- 4.4 High-Resolution Timer 81
- 4.5 Clock Generators and PLLs 83
- Circuitry 84
- Default ADL Multiplier 85
- 0111 33.33 4 0100 133 85
- 4.5.4 SuperI/O Clocks 86
- 4.5.6 Video Processor Clocks 86
- 4.5.7 Clock Registers 87
- 5.0SuperI/O Module 89
- 5.1 Features 90
- 5.2 Module Architecture 91
- 5.3.4 Address Decoding 93
- Configuration 98
- SuperI/O Module 100
- 5.5 Real-Time Clock (RTC) 105
- 5.5.3 RTC Registers 111
- Table 5-19. RTC Register Map 111
- Table 5-20. RTC Registers 111
- Table 5-25. Extended RAM Map 115
- Table 5-24. Standard RAM Map 115
- 5.6.1 Event Detection 116
- Type Name 117
- Type Name 117
- 5.7 ACCESS.bus Interface 121
- 5.7.3 Acknowledge (ACK) Cycle 122
- 5.7.6 Arbitration on the Bus 123
- 5.7.7 Master Mode 123
- 5.7.8 Slave Mode 125
- 5.7.9 Configuration 125
- 5.8 Legacy Functional Blocks 129
- Offset Name 130
- 404h EDR Data Bits 130
- Architecture 131
- Table 5-43. Bank 1 Bit Map 134
- Table 5-44. Bank 2 Bit Map 134
- Table 5-45. Bank 3 Bit Map 134
- Port 3 (SP3) Functionality 135
- Table 5-56. Bank 1 Bit Map 139
- Table 5-57. Bank 2 Bit Map 139
- Table 5-58. Bank 3 Bit Map 139
- Table 5-59. Bank 4 Bit Map 139
- Table 5-60. Bank 5 Bit Map 140
- Table 5-61. Bank 6 Bit Map 140
- Table 5-62. Bank 7 Bit Map 140
- 6.0Core Logic Module 141
- 6.2 Module Architecture 142
- 6.2.2 PSERIAL Interface 143
- 6.2.3 IDE Controller 144
- Core Logic Module 146
- 6.2.4 Universal Serial Bus 147
- 6.2.5 Sub-ISA Bus Interface 147
- 6.2.6 AT Compatibility Logic 152
- Figure 6-7. PIT Timer 154
- 6.2.8 Keyboard Support 157
- C1 Power State - Active Idle 158
- Sleep States 160
- 6.2.11 GPIO Interface 167
- 6.2.12 Integrated Audio 167
- AMD Geode™ 170
- Processor 170
- SMI# (System Management 171
- Read to Clear 172
- Figure 6-15. Typical Setup 173
- Table 6-12. Cycle Types 174
- 6.3 Register Descriptions 175
- 6.3.2 Register Summary 176
- 6.4 Chipset Register Space 190
- CPI mode 202
- . Reads as 0 220
- 20h and 24h) 221
- 1), this bit allows signal 230
- Not Used Reset Value: 00h 244
- . Must be set to 0 252
- 0 Reserved. (Read Only) 260
- Not Used 269
- : X-Bus Expansion Registers 278
- 00h/02h[14] 278
- Reserved Reset Value = xxh 291
- 7.0Video Processor Module 307
- 7.1 Module Architecture 308
- 7.2 Functional Description 309
- (Not normally User Data) 310
- Figure 7-4. VIP Block Diagram 311
- Video Processor Module 312
- 7.2.2 Video Block 315
- 7.2.3 Mixer/Blender Block 318
- Windows Configuration 321
- 7.2.5 Integrated DACs 323
- 7.2.6 TFT Interface 324
- crystal oscilla 325
- 7.3 Register Descriptions 326
- 8.0Debugging and Monitoring 349
- Debugging and Monitoring 350
- 9.0Electrical Specifications 351
- 9.1.4 Operating Conditions 352
- 9.1.5 DC Current 353
- Electrical Specifications 354
- 9.2 DC Characteristics 358
- 9.3 AC Characteristics 363
- GX1 Processor Series Data 365
- 9.3.2 Video Port 367
- 9.3.3 CRT and TFT Interface 368
- 9.3.4 ACCESS.bus Interface 370
- Note 2. t 371
- Ω1 KΩ 10 pF 373
- Figure 9-18. PCI Reset Timing 378
- 9.3.6 Sub-ISA Interface 379
- 9.3.7 LPC Interface 383
- 9.3.8 IDE Interface 384
- 9.3.11 Fast IR Port 407
- 9.3.13 Audio Interface (AC97) 412
- 9.3.14 Power Management 417
- 9.3.15 Power-Up Sequencing 418
- 9.3.16 JTAG Interface 420
- 10.0Package Specifications 423
- Figure 10-1. Heatsink Example 424
- 10.2 Physical Dimensions 425
- Package Specifications 426
- A.1 Order Information 427
- Table A-1. Revision History 428
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