Amd 1207 User Manual download pdf (Page 14)

14 Processor Thermal Solutions Chapter 2

32800 Rev. 3.02 August 2006

Thermal Design Guide for Socket F (1207) Processors

2.2 Socket Description

Figure 1 shows a three-dimensional view of the 1207-pin socket used with socket F (1207)

processors. This socket is based on LGA (land-grid array) technology. The LGA socket has 35 pads x

35 pads on a 1.1 mm pitch, with a 3.52 mm wide de-populated BGA (ball grid array) zone in the

center, plus a 0.66 mm offset between the two BGA arrays. A small solder-ball makes the electrical

and mechanical connection to the motherboard at each socket contact.

Figure 1. The 1207-Pin Socket

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Amd 1207 User Manual Page 14