Amd 1207 User Manual download pdf (Page 25)

Chapter 4 Thermal Design of Custom 1U-2P Systems 25

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 3.00 August 2006

Lifting the heat sink away from the processor can result in damage to the processor contact pads, the

socket contacts, or the socket solder-ball joints. Maintaining the spring force is important for the life

of the processor and the socket and for repeated installations and upgrades of the processor.

4.3.3 Heat Sink

Figure 6 shows a picture of the reference design heat sink for 1U-2P systems. The footprint of the

heat sink is 87 mm x 74 mm. The heat sink weighs 420 g and has aluminum fins soldered to a copper

base. The copper base tapers from a thickness of 6 mm at the center to 1.5 mm at the edges. This

tapering provides optimum heat-spreading performance from the processor to the heat sink while

keeping the heat sink weight within specification. The fin geometry is designed to provide optimized

thermal performance in combination with the fans, as described in Section 4.3.4, on page 26, in a

typical 1U-2P system.

Figure 6. High Performance Heat Sink for Custom 1U-2P Systems

Table 6 shows the parameters of the aluminum fins for the high-performance heat sink shown in

Figure 6.

Table 6. Fin Parameters

Length

Height (at

Center)

Height (at Edges) Thickness Pitch No. of Fins

87 mm 22 mm 26.5 mm 0.4 mm 1.48

1 2 ... 20 21 22 23 24 25 26 27 28 29 30 ... 61 62

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Amd 1207 User Manual Page 25