Amd 1207 User Manual download pdf (Page 18)

18 Thermal Design of Platforms Using the AMD Processor-In-a-

Box (PIB) Thermal Solution

Chapter 3

32800 Rev. 3.02 August 2006

Thermal Design Guide for Socket F (1207) Processors

Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207)

Processors

3.3.1 Backplate Assembly

The backplate is mounted on the backside of the motherboard and enhances local stiffness to support

shock and vibration loads acting on the heat sink. The backplate assembly prevents excessive

motherboard warpage in the area near the processor. Without a backplate, excessive warpage could

cause serious damage to electrical connections of the processor socket and integrated circuit packages

surrounding the processor. The backplate also serves as a stiffener plate for the LGA socket.

The reference backplate is made from a 1/16-inch, hard-milled steel, has an overall thickness of 0.138

inch (3.5 mm), including stiffening ribs, and has a mounting-hole pitch of 3.5 inches. To

accommodate the capacitors on the backside of the board, there is a square hole in the center of the

backplate.

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Amd 1207 User Manual Page 18