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Chapter 5 Thermal Design of Custom 2U-4P Systems 29

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.02 August 2006

Chapter 5 Thermal Design of Custom 2U-4P

Systems

This chapter describes the motherboard component-height restrictions, thermal-solution design

requirements, sample heat sinks, and attachment methods for custom 2U-4P systems based on socket

F (1207) processors.

Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and

acoustic performance in these systems. These keep-outs are not compliant with AMD

Processor-In-a-Box (PIB) thermal solutions.

5.1 Motherboard Component Height Restrictions

The mounting solution for the heat sink calls for a standard motherboard keep-out region and

mounting holes for the processor. Figure 8 shows an overview of the motherboard component height

restrictions for custom 2U-4P systems based on the thermal solution for socket F (1207) processors.

Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems

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Amd 1207 User Manual Page 29