Amd 1207 User Manual download pdf (Page 19)

Chapter 3 Thermal Design of Platforms Using the AMD Processor-In-a-

Box (PIB) Thermal Solution

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.00 August 2006

Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the

backplate.

The plate uses two PennEngineering (PEM) standoffs that serve multiple purposes. The PEM

standoffs serve as attachment points for the retention frame screws. They also align the backplate

properly to the motherboard. Features in the retention frame slide over the standoffs and allow the

installation of the screws with a minimum chance of cross threading. Additionally, four M3.5 PEM

standoffs in the backplate serve as attachment points for the socket.

The insulator prevents the backplate from electrically shorting to the motherboard. A pressure-

sensitive adhesive in the insulator keeps the backplate in place against the motherboard during

assembly. The insulator also is thick enough to prevent any significant capacitive coupling between

the motherboard and backplate.

3.3.2 Retention Frame

The plastic retention frame, made of 20% glass-filled Lexan, is a two-piece implementation rather

than the single-piece frame used for socket 940. This change accommodates the larger foot-print of

socket F (1207) processors.

The retention frame serves multiple purposes. The retention frame aligns the heat sink and provides a

stop for the heat sink in large shock-force events. The retention frame and backplate are attached to

the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention

frame together. The two mounting tabs on the retention frame serve as attachment points for the heat

sink spring clip.

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Amd 1207 User Manual Page 19