Amd 1207 User Manual download pdf (Page 16)

16 Thermal Design of Platforms Using the AMD Processor-In-a-

Box (PIB) Thermal Solution

Chapter 3

32800 Rev. 3.02 August 2006

Thermal Design Guide for Socket F (1207) Processors

Depending on the system features and layout, more space around the socket may be available for the

thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with

better thermal performance.

Appendix A on page 37 shows a complete, detailed set of keep-out drawings for the AMD PIB

thermal solution for socket F (1207).

3.2 Thermal Solution Design Requirements

Table 2 provides the design-target specifications that must be met for the processor to operate reliably

in a typical platform using the AMD PIB thermal solution for socket F (1207) processors.

3.3 Sample Heat Sinks and Attachment Methods

The heat sink, fan, mounting spring clip, and thermal interface material used for the AMD PIB

thermal solution for socket F (1207) processors are the same as the heat sink, fan, mounting spring

clip, and thermal interface material used for systems based on the socket 940 processor.

The backplate and retention frame are different from those used in the socket 940 processor. The

EMC shield implemented in the socket 940-based systems is not recommended for AMD PIB thermal

solutions for socket F (1207) processors.

Table 2. Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB

processors

Symbol Description Maximum

L Length of heat sink 68 mm

W Width of heat sink 77 mm

H Height of heat sink 60 mm

Case-to-ambient thermal

resistance

0.26°C/W

Mass of heat sink

450 g to 700 g

clip

Clip force 75 lbs ±15 lbs

Local ambient temperature near

processor

38°C

Notes:

1. This is the thermal resistance required for dual-core, 90-nm socket F (1207) processors. The thermal resistance

requirement may vary depending on the product OPN. The user should consult the processor data sheet for the

thermal requirements specific to the part.

2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied

directly to the chassis for reliable shock and vibration performance.

1 2 ... 11 12 13 14 15 16 17 18 19 20 21 ... 61 62

No comments

Amd 1207 User Manual Page 16