Amd 1207 User Manual download pdf (Page 37)

Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal

Solution for Socket F (1207) Processors

Thermal Design Guide for Socket F (1207) Processors

32800 Rev. 3.00 August 2006

Appendix A Keep-Out Drawings for Platforms

Using the PIB Thermal Solution for

Socket F (1207) Processors

Appendix A contains detailed recommended keep-out drawings for processor heat sink and mounting

hardware for platforms using socket F (1207) Processor-In-a-Box (PIB) processors. Depending on the

system features and layout, more space around the processor may be available for the thermal

solution than is shown in these drawings. This space permits the design of heat sinks with better

thermal performance.

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Amd 1207 User Manual Page 37